As data centers adopt liquid cooling, fitting in new cooling distribution infrastructure can be a real challenge. From hyperscale and colocation environments to edge applications, the Vertiv XDU simplifies your work with the flexibility to support rear door heat exchangers or direct to chip liquid cooling. The Vertiv XDU’s compact footprint allows for placement in the row, allowing you to easily distribute coolant to efficiently manage power-dense applications up to 70kW. Compact footprint for deployment flexibility within the row; Efficient Cooling Distribution to manage power-dense hot spots and up to 70kW; Precise Temperature Control to eliminate thermal shock for server CPU and GPUs; Redundant Pumps and Dual Power Feeds for optimizing reliable operation; Remote Monitoring available through communications with HTTP, SNMP, RS-485 Modbus, Modbus IP.